Mesh network within a device

ABSTRACT

A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.

BACKGROUND

1. Technical Field

The present invention relates to wireless communications and, moreparticularly, to circuitry for wireless communications.

2. Related Art

Communication systems are known to support wireless and wire linedcommunications between wireless and/or wire lined communication devices.Such communication systems range from national and/or internationalcellular telephone systems to the Internet to point-to-point in-homewireless networks. Each type of communication system is constructed, andhence operates, in accordance with one or more communication standards.For instance, wireless communication systems may operate in accordancewith one or more standards, including, but not limited to, IEEE 802.11,Bluetooth, advanced mobile phone services (AMPS), digital AMPS, globalsystem for mobile communications (GSM), code division multiple access(CDMA), local multi-point distribution systems (LMDS),multi-channel-multi-point distribution systems (MMDS), and/or variationsthereof.

Depending on the type of wireless communication system, a wirelesscommunication device, such as a cellular telephone, two-way radio,personal digital assistant (PDA), personal computer (PC), laptopcomputer, home entertainment equipment, etc., communicates directly orindirectly with other wireless communication devices. For directcommunications (also known as point-to-point communications), theparticipating wireless communication devices tune their receivers andtransmitters to the same channel or channels (e.g., one of a pluralityof radio frequency (RF) carriers of the wireless communication system)and communicate over that channel(s). For indirect wirelesscommunications, each wireless communication device communicates directlywith an associated base station (e.g., for cellular services) and/or anassociated access point (e.g., for an in-home or in-building wirelessnetwork) via an assigned channel. To complete a communication connectionbetween the wireless communication devices, the associated base stationsand/or associated access points communicate with each other directly,via a system controller, via a public switch telephone network (PSTN),via the Internet, and/or via some other wide area network.

Each wireless communication device includes a built-in radio transceiver(i.e., receiver and transmitter) or is coupled to an associated radiotransceiver (e.g., a station for in-home and/or in-building wirelesscommunication networks, RF modem, etc.). As is known, the transmitterincludes a data modulation stage, one or more intermediate frequencystages, and a power amplifier stage. The data modulation stage convertsraw data into baseband signals in accordance with the particularwireless communication standard. The one or more intermediate frequencystages mix the baseband signals with one or more local oscillations toproduce RF signals. The power amplifier stage amplifies the RF signalsprior to transmission via an antenna.

Typically, the data modulation stage is implemented on a basebandprocessor chip, while the intermediate frequency (IF) stages and poweramplifier stage are implemented on a separate radio processor chip.Historically, radio integrated circuits have been designed usingbi-polar circuitry, allowing for large signal swings and lineartransmitter component behavior. Therefore, many legacy basebandprocessors employ analog interfaces that communicate analog signals toand from the radio processor.

As integrated circuit die decrease in size while the number of circuitcomponents increases, chip layout becomes increasingly difficult andchallenging. Amongst other known problems, there is increasingly greaterdemand for output pins to a die even though the die size is decreasing.Similarly, within the die itself, the challenge of developing internalbuses and traces to support high data rate communications becomes verychallenging. A need exists, therefore, for solutions that support thehigh data rate communications and reduce the need for pin-outs and forcircuit traces within the bare die. Moreover, advancements incommunication between ICs collocated within a common device or upon acommon printed circuit board is needed to adequately support theforth-coming improvements in IC fabrication. Therefore, a need existsfor an integrated circuit antenna structure and wireless communicationapplications thereof.

SUMMARY OF THE INVENTION

The present invention is directed to apparatus and methods of operationthat are further described in the following Brief Description of theDrawings, the Detailed Description of the Invention, and the claims.Other features and advantages of the present invention will becomeapparent from the following detailed description of the invention madewith reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

A better understanding of the present invention can be obtained when thefollowing detailed description of the preferred embodiment is consideredwith the following drawings, in which:

FIG. 1 is a schematic block diagram illustrating a wirelesscommunication device that includes a host device and an associatedradio;

FIG. 2 is a schematic block diagram illustrating a wirelesscommunication device that includes a host device and an associatedradio;

FIG. 3 is a functional block diagram of a substrate configured accordingto one embodiment of the invention;

FIG. 4 is a functional block diagram of an alternate embodiment of asubstrate that includes a plurality of embedded substrate transceivers;

FIG. 5 is a functional block diagram of a substrate that includes aplurality of embedded substrate transceivers surrounded by integratedcircuit modules and circuitry according to one embodiment of the presentinvention;

FIG. 6 is a functional block diagram of a substrate that includes aplurality of transceivers operably disposed to communicate through waveguides formed within the substrate according to one embodiment of thepresent invention;

FIG. 7 is a flow chart of a method according to one embodiment of thepresent invention;

FIG. 8 is a functional block diagram of a substrate illustrating threelevels of transceivers according to one embodiment of the presentinvention;

FIG. 9 is a functional block diagram of a multi-chip module formedaccording to one embodiment of the present invention;

FIG. 10 is a flow chart of a method for communicating according to oneembodiment of the present invention;

FIG. 11 is a diagram that illustrates transceiver placement within asubstrate according to one embodiment of the present invention;

FIG. 12 is an illustration of an alternate embodiment of a substrate;

FIG. 13 is a flow chart that illustrates a method according to oneembodiment of the present invention;

FIG. 14 is a functional block diagram of an integrated circuitmulti-chip device and associated communications according to oneembodiment of the present invention;

FIG. 15 is a functional block diagram that illustrates operation of oneembodiment of the present invention utilizing frequency divisionmultiple access;

FIG. 16 is a table illustrating an example of assignment static orpermanent assignment of carrier frequencies to specified communicationsbetween intra-device local transceivers, substrate transceivers, andother transceivers within a specified device;

FIG. 17 is a functional block diagram of a device housing a plurality oftransceivers and operating according to one embodiment of the presentinvention;

FIG. 18 is a flow chart that illustrates a method for wirelesstransmissions in an integrated circuit utilizing frequency divisionmultiple access according to one embodiment of the invention;

FIG. 19 is a functional block diagram that illustrates an apparatus andcorresponding method of wireless communications within the apparatus foroperably avoiding collisions and interference utilizing a collisionavoidance scheme to coordinate communications according to oneembodiment of the invention;

FIG. 20 is a functional block diagram of a substrate supporting aplurality of local transceivers operable according to one embodiment ofthe invention;

FIG. 21 illustrates a method for wireless local transmissions in adevice according to one embodiment of the invention;

FIG. 22 is a functional block diagram a device that includes a meshnetwork formed within a board or integrated circuit according to oneembodiment of the invention;

FIG. 23 is a flow chart illustrating a method according to oneembodiment of the invention for routing and forwarding communicationsamongst local transceivers operating as nodes of a mesh network allwithin a single device;

FIG. 24 illustrates a method for communications within a deviceaccording to one embodiment of the invention in which communications aretransmitted through a mesh network within a single device;

FIG. 25 is a functional block diagram of a network operating accordingto one embodiment of the present invention; and

FIG. 26 is a flow chart illustrating a method according to oneembodiment of the invention.

DETAILED DESCRIPTION OF THE DRAWINGS

FIG. 1 is a functional block diagram illustrating a communication systemthat includes circuit devices and network elements and operation thereofaccording to one embodiment of the invention. More specifically, aplurality of network service areas 04, 06 and 08 are a part of a network10. Network 10 includes a plurality of base stations or access points(APs) 12-16, a plurality of wireless communication devices 18-32 and anetwork hardware component 34. The wireless communication devices 18-32may be laptop computers 18 and 26, personal digital assistants 20 and30, personal computers 24 and 32 and/or cellular telephones 22 and 28.The details of the wireless communication devices will be described ingreater detail with reference to FIGS. 2-10.

The base stations or APs 12-16 are operably coupled to the networkhardware component 34 via local area network (LAN) connections 36, 38and 40. The network hardware component 34, which may be a router,switch, bridge, modem, system controller, etc., provides a wide areanetwork (WAN) connection 42 for the communication system 10 to anexternal network element such as WAN 44. Each of the base stations oraccess points 12-16 has an associated antenna or antenna array tocommunicate with the wireless communication devices in its area.Typically, the wireless communication devices 18-32 register with theparticular base station or access points 12-16 to receive services fromthe communication system 10. For direct connections (i.e.,point-to-point communications), wireless communication devicescommunicate directly via an allocated channel.

Typically, base stations are used for cellular telephone systems andlike-type systems, while access points are used for in-home orin-building wireless networks. Regardless of the particular type ofcommunication system, each wireless communication device includes abuilt-in radio and/or is coupled to a radio. For purposes of the presentspecification, each wireless communication device of FIG. 1 includinghost devices 18-32, and base stations or APs 12-16, includes at leastone associated radio transceiver for wireless communications with atleast one other remote transceiver of a wireless communication device asexemplified in FIG. 1. More generally, a reference to a remotecommunication or a remote transceiver refers to a communication ortransceiver that is external to a specified device or transceiver. Assuch, each device and communication made in reference to Figure one is aremote device or communication. The embodiments of the invention includedevices that have a plurality of transceivers operable to communicatewith each other. Such transceivers and communications are referencedhere in this specification as local transceivers and communications.

FIG. 2 is a schematic block diagram illustrating a wirelesscommunication device that includes the host device 18-32 and anassociated radio 60. For cellular telephone hosts, the radio 60 is abuilt-in component. For personal digital assistants hosts, laptop hosts,and/or personal computer hosts, the radio 60 may be built-in or anexternally coupled component.

As illustrated, the host device 18-32 includes a processing module 50,memory 52, radio interface 54, input interface 58 and output interface56. The processing module 50 and memory 52 execute the correspondinginstructions that are typically done by the host device. For example,for a cellular telephone host device, the processing module 50 performsthe corresponding communication functions in accordance with aparticular cellular telephone standard.

The radio interface 54 allows data to be received from and sent to theradio 60. For data received from the radio 60 (e.g., inbound data), theradio interface 54 provides the data to the processing module 50 forfurther processing and/or routing to the output interface 56. The outputinterface 56 provides connectivity to an output display device such as adisplay, monitor, speakers, etc., such that the received data may bedisplayed. The radio interface 54 also provides data from the processingmodule 50 to the radio 60. The processing module 50 may receive theoutbound data from an input device such as a keyboard, keypad,microphone, etc., via the input interface 58 or generate the dataitself. For data received via the input interface 58, the processingmodule 50 may perform a corresponding host function on the data and/orroute it to the radio 60 via the radio interface 54.

Radio 60 includes a host interface 62, a baseband processing module 100,memory 65, a plurality of radio frequency (RF) transmitters 106-110, atransmit/receive (T/R) module 114, a plurality of antennas 81-85, aplurality of RF receivers 118-120, and a local oscillation module 74.The baseband processing module 100, in combination with operationalinstructions stored in memory 65, executes digital receiver functionsand digital transmitter functions, respectively. The digital receiverfunctions include, but are not limited to, digital intermediatefrequency to baseband conversion, demodulation, constellation demapping,decoding, de-interleaving, fast Fourier transform, cyclic prefixremoval, space and time decoding, and/or descrambling. The digitaltransmitter functions include, but are not limited to, scrambling,encoding, interleaving, constellation mapping, modulation, inverse fastFourier transform, cyclic prefix addition, space and time encoding, anddigital baseband to IF conversion. The baseband processing module 100may be implemented using one or more processing devices. Such aprocessing device may be a microprocessor, micro-controller, digitalsignal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on operationalinstructions. The memory 65 may be a single memory device or a pluralityof memory devices. Such a memory device may be a read-only memory,random access memory, volatile memory, non-volatile memory, staticmemory, dynamic memory, flash memory, and/or any device that storesdigital information. Note that when the baseband processing module 100implements one or more of its functions via a state machine, analogcircuitry, digital circuitry, and/or logic circuitry, the memory storingthe corresponding operational instructions is embedded with thecircuitry comprising the state machine, analog circuitry, digitalcircuitry, and/or logic circuitry.

In operation, the radio 60 receives outbound data 94 from the hostdevice via the host interface 62. The baseband processing module 100receives the outbound data 94 and, based on a mode selection signal 102,produces one or more outbound symbol streams 104. The mode selectionsignal 102 will indicate a particular mode of operation that iscompliant with one or more specific modes of the various IEEE 802.11standards. For example, the mode selection signal 102 may indicate afrequency band of 2.4 GHz, a channel bandwidth of 20 or 22 MHz and amaximum bit rate of 54 megabits-per-second. In this general category,the mode selection signal will further indicate a particular rateranging from 1 megabit-per-second to 54 megabits-per-second. Inaddition, the mode selection signal will indicate a particular type ofmodulation, which includes, but is not limited to, Barker CodeModulation, BPSK, QPSK, CCK, 16 QAM and/or 64 QAM. The mode selectionsignal 102 may also include a code rate, a number of coded bits persubcarrier (NBPSC), coded bits per OFDM symbol (NCBPS), and/or data bitsper OFDM symbol (NDBPS). The mode selection signal 102 may also indicatea particular channelization for the corresponding mode that provides achannel number and corresponding center frequency. The mode selectionsignal 102 may further indicate a power spectral density mask value anda number of antennas to be initially used for a MIMO communication.

The baseband processing module 100, based on the mode selection signal102 produces one or more outbound symbol streams 104 from the outbounddata 94. For example, if the mode selection signal 102 indicates that asingle transmit antenna is being utilized for the particular mode thathas been selected, the baseband processing module 100 will produce asingle outbound symbol stream 104. Alternatively, if the mode selectionsignal 102 indicates 2, 3 or 4 antennas, the baseband processing module100 will produce 2, 3 or 4 outbound symbol streams 104 from the outbounddata 94.

Depending on the number of outbound symbol streams 104 produced by thebaseband processing module 100, a corresponding number of the RFtransmitters 106-110 will be enabled to convert the outbound symbolstreams 104 into outbound RF signals 112. In general, each of the RFtransmitters 106-110 includes a digital filter and upsampling module, adigital-to-analog conversion module, an analog filter module, afrequency up conversion module, a power amplifier, and a radio frequencybandpass filter. The RF transmitters 106-110 provide the outbound RFsignals 112 to the transmit/receive module 114, which provides eachoutbound RF signal to a corresponding antenna 81-85.

When the radio 60 is in the receive mode, the transmit/receive module114 receives one or more inbound RF signals 116 via the antennas 81-85and provides them to one or more RF receivers 118-122. The RF receiver118-122 converts the inbound RF signals 116 into a corresponding numberof inbound symbol streams 124. The number of inbound symbol streams 124will correspond to the particular mode in which the data was received.The baseband processing module 100 converts the inbound symbol streams124 into inbound data 92, which is provided to the host device 18-32 viathe host interface 62.

As one of average skill in the art will appreciate, the wirelesscommunication device of FIG. 2 may be implemented using one or moreintegrated circuits. For example, the host device may be implemented ona first integrated circuit, the baseband processing module 100 andmemory 65 may be implemented on a second integrated circuit, and theremaining components of the radio 60, less the antennas 81-85, may beimplemented on a third integrated circuit. As an alternate example, theradio 60 may be implemented on a single integrated circuit. As yetanother example, the processing module 50 of the host device and thebaseband processing module 100 may be a common processing deviceimplemented on a single integrated circuit. Further, the memory 52 andmemory 65 may be implemented on a single integrated circuit and/or onthe same integrated circuit as the common processing modules ofprocessing module 50 and the baseband processing module 100.

FIG. 2 generally illustrates a MIMO transceiver and is useful tounderstanding the fundamental blocks of a common transceiver. It shouldbe understood that any connection shown in FIG. 2 may be implemented asa physical trace or as a wireless communication link. Such wirelesscommunication links are supported by local transceivers (not shown inFIG. 2) that are operable to transmit through space or through anelectromagnetic wave guide formed within a substrate of a printedcircuit board housing the various die that comprise the MIMO transceiveror within a substrate of a die (e.g., a dielectric substrate).Illustrations of circuitry and substrate structures to support suchoperations are described in greater detail in the Figures that follow.

It is generally known that an inverse relationship exists betweenfrequency and signal wavelength. Because antennas for radiating radiofrequency signals are a function of a signal wavelength, increasingfrequencies result in decreasing wavelengths which therefore result indecreasing antenna lengths to support such communications. In futuregenerations of radio frequency transceivers, the carrier frequency willexceed or be equal to at least 10 GHz, thereby requiring a relativelysmall monopole antenna or dipole antenna. A monopole antenna willtypically be equal to a size that is equal to a one-half wavelength,while a dipole antenna will be equal to a one-quarter wavelength insize. At 60 GHz, for example, a full wavelength is 5 millimeters, thus amonopole antenna size will be approximately equal to 2.5 millimeters anddipole antenna size will be approximately equal to 1.25 millimeters.With such a small size, the antenna may be implemented on the printedcircuit board of the package and/or on the die itself. As such, theembodiments of the invention include utilizing such high frequency RFsignals to allow the incorporation of such small antenna either on a dieor on a printed circuit board.

Printed circuit boards and die often have different layers. With respectto printed circuit boards, the different layers have different thicknessand different metallization. Within the layers, dielectric areas may becreated for use as electromagnetic wave guides for high frequency RFsignals. Use of such wave guides provides an added benefit that thesignal is isolated from outside of the printed circuit board. Further,transmission power requirements are reduced since the radio frequencysignals are conducted through the dielectric in the wave guide and notthrough air. Thus, the embodiments of the present invention include veryhigh frequency RF circuitry, for example, 60 GHz RF circuitry, which aremounted either on the printed circuit board or on the die to facilitatecorresponding communications.

FIG. 3 is a functional block diagram of a substrate configured accordingto one embodiment of the invention that includes a dielectric substrateoperable as an electromagnetic wave guide according to one embodiment ofthe present invention. Referring to FIG. 3, it may be seen that asubstrate 150 includes a transceiver 154 that is operably disposed tocommunicate with a transceiver 158. References herein to substratesgenerally refer to any supporting substrate and specifically includeprinted circuit boards and other boards that support integrated circuitsand other circuitry. References to substrate also include semiconductorsubstrates that are part of integrated circuits and die that supportcircuit elements and blocks. Thus, unless specifically limited hereinthis specification to a particular application, the term substrateshould be understood to include all such applications with their varyingcircuit blocks and elements. Thus, with reference to substrate 150 ofFIG. 3, the substrate 150 may be a printed circuit board wherein thetransceivers may be separate integrated circuits or die operablydisposed thereon. Alternatively, substrate 150 may be a integratedcircuit wherein the transceivers are transceiver modules that are a partof the integrated circuit die circuitry.

In the described embodiment of the invention, transceiver 154 iscommunicatively coupled to antenna 166, while transceiver 158 iscommunicatively coupled to antenna 170. The first and second substrateantennas 166 and 170, respectively, are operably disposed to transmitand receive radio frequency communication signals through the substrateregion 162 which, in the described embodiment, is a dielectric substrateregion. As may be seen, antenna 166 is operably disposed upon a topsurface of dielectric substrate 162, while antenna 170 is operablydisposed to penetrate into dielectric substrate 162. Each of theseantenna configurations exemplifies different embodiments for substrateantennas that are for radiating and receiving radio frequency signalstransmitted through dielectric substrate 162. As may further be seenfrom examining FIG. 3, an optional metal layer 174 may be disposed uponeither or both of a top surface and a bottom surface of dielectricsubstrate 162. Metal layers 174 are operable to further isolate andshield the electromagnetic waves transmitted through dielectricsubstrate 162 as high frequency RF. The use of such metal layers 174 isespecially applicable to embodiments of the invention in which thesubstrate comprises a printed circuit board but can include anystructure having a deposited metal layer thereon.

In operation, transceiver 154 is a very high frequency transceiver thatgenerates electromagnetic signals having a frequency that is greaterthan or equal to 10 GHz. In one specific embodiment of the invention,the electromagnetic signals are characterized by a 60 GHz (+/−5 GHz)radio frequency. One corresponding factor to using such high frequencyelectromagnetic signals is that short antenna lengths may be utilizedthat are sized small enough to be placed on or within a substratewhether that substrate is a printed circuit board or a bare die. Thus,transceiver 154 is operable to radiate through dielectric substrate 162through antenna 166 for reception by antenna 170 for substratetransceiver 158. These transceivers are specifically named substratetransceivers herein to refer to transceivers that have been designed tocommunicate through a dielectric substrate, such as that shown in FIG.3.

It should be noted that dielectric substrate 162 is defined by a boundvolume, regardless of whether metal layers 174 are included, and is theequivalent of an electromagnetic wave guide and shall be referencedherein as such. In general terms, it is expected that dielectricsubstrate 162 will have a reasonably uniform fabrication to reduceinterference within the dielectric substrate 162. For example, metalcomponents, or other components within the dielectric substrate, willtend to create multi-path interference and/or absorb the electromagneticsignals thereby reducing the effectiveness of the transmission. With areasonably uniform or consistent dielectric substrate, however, lowpower signal transmissions may be utilized for such short rangecommunications.

FIG. 4 is a functional block diagram of an alternate embodiment of asubstrate that includes a plurality of embedded substrate transceivers.As may be seen, a substrate 180 includes a dielectric substrate region184 that includes embedded substrate transceivers 188 and 192 that areoperable to communicate with each other. As may be seen, substratetransceiver 188 includes a substrate antenna 196, while substratetransceiver 192 includes a second substrate antenna 198.

Substrate transceivers 188 and 192 are operably disposed within thedielectric substrate 184, as is each of their antennas 196 and 198,respectively, and are operable to transmit the very high frequencyelectromagnetic signals through the wave guide, which is formed bydielectric substrate 184. As described in relation to FIG. 3, a metallayer is optional but not required.

Generally, while the metal layer is not required either on the top orbottom layer of the substrate, the metal is helpful to isolate theelectromagnetic signals contained within the wave guide to reduceinterference of those signals with external circuitry or the signalsfrom external circuitry to interfere with the electromagnetic signalstransmitted through the wave guide. The boundary of the dielectricsubstrate reflects the radio frequency of electromagnetic signals tokeep the signals within the dielectric substrate 184 and thereforeminimize interference with external circuitry and devices on top of orwithin the dielectric. The substrate antennas are sized and placed toradiate only through the dielectric substrate 184.

FIG. 5 is a functional block diagram of a substrate that includes aplurality of substrate transceivers surrounded by integrated circuitmodules and circuitry according to one embodiment of the presentinvention. As may be seen, a substrate 200 includes an embeddedsubstrate transceiver 204 that is operable to communicate with asubstrate transceiver 208 by way of substrate antennas 212 and 216,respectively. While transceiver 204 is embedded in the dielectricsubstrate 220, transceiver 208 is operably disposed on a surface ofdielectric substrate 220.

The electromagnetic signals are transmitted from transceivers 204 and208 through the substrate antennas 212 and 216 to radiate through adielectric substrate 220. In the embodiment shown, dielectric substrate220 is bounded by metal layers 222 which further shield theelectromagnetic signals transmitted through the wave guide that isformed by dielectric substrate 220. The dielectric substrate 220 issurrounded, as may be seen, by IC modules 224, 228 and 232. In thespecific embodiment of substrate 200, one typical application would be aprinted circuit board in which the dielectric substrate is formed withinthe printed circuit board which is then layered with metal layer 222 andoperably supports ICs 224, 228 and 232. The metal layer 222 not only isoperable as a shield, but may also be used to conduct signals in supportof IC modules 224, 228 and 232. For exemplary purposes, transceiver 208is operable to support communications for IC module 224 whiletransceiver 204 is operable to support communications for IC module 228.

FIG. 6 is a functional block diagram of a substrate that includes aplurality of transceivers operably disposed to communicate through waveguides formed within the substrate according to one embodiment of thepresent invention. As may be seen, a substrate 250 includes a pluralityof transceivers 252, 254, 256, 258, 260, and 262. Each transceiver252-262 has associated circuitry not shown here and can be operablydisposed within the dielectric or on top of the dielectric with anassociated antenna protruding into the dielectric. As may be seen, thesubstrate 250 includes a plurality of wave guides formed within forconducting specific communications between specified transceivers. Forexample, a wave guide 264 is operably disposed to support communicationsbetween transceivers 252 and 254. Similarly, wave guides 266 supportcommunications between transceivers 254, 256, 262, 260, and 258, asshown.

Some other noteworthy configurations may also be noticed. For example, awave guide 268 supports transmissions from transceiver 252 totransceivers 258 and 260. Alternatively, each of the transceivers 258and 260 may transmit only to transmitter 252 through wave guide 268because of the shape of wave guide 268. An additional configurationaccording to one embodiment of the invention, may be seen with waveguides 270 and 272. As may be seen, wave guide 270 overlaps wave guide272 wherein wave guide 270 supports communications between transceivers260 and 256, while wave guide 272 supports communications betweentransceivers 254 and 262. At least in this example, the wave guides 270and 272 are overlapping but isolated from each other to prevent theelectromagnetic radiation therein from interfering with electromagneticradiation of the other wave guide.

In general, it may be seen that the wave guides shown within substrate250 support a plurality of directional communications between associatedtransceivers. In the embodiment of FIG. 6, the substrate may be either aboard, such as a printed circuit board, or an integrated circuit whereineach transceiver is a transceiver block or module within the integratedcircuit. In this embodiment of the invention, the wave guides are formedof a dielectric substrate material and are bounded to contain andisolate the electromagnetic signals transmitted therein. Further, asdescribed in previous embodiments, the frequency of the electromagneticsignals is a very high radio frequency in the order of tens of GHz. Inone specific embodiment, the frequency is equal to 60 GHz (+/−5 GHz).One aspect of this embodiment of the invention is that a transceiver maycommunicate to an intended transceiver by way of another transceiver.For example, if transceiver 252 seeks to deliver a communication totransceiver 256, transceiver 252 has the option of transmitting thecommunication signals by way of wave guides 264 and 266 throughtransceiver 254 or, alternatively, by wave guides 268 and 270 throughtransceiver 260.

FIG. 7 is a flow chart of a method according to one embodiment of thepresent invention. The method includes initially generating a very highradio frequency signal of at least 10 GHz (step 280). In one embodimentof the invention, the very high radio frequency signal is a 60 GHz (+/−5GHz) signal. Thereafter the method includes transmitting the very highradio frequency signal from a substrate antenna coupled to a substratetransceiver at a very low power (step 284). Because the electromagneticradiation of the signal is being radiated through a substrate instead ofthrough space, lower power is required. Moreover, because the substrateis operable as a wave guide with little or no interference, even lesspower is required because power is not required to overcome significantinterference. Thereafter the method includes receiving the very highradio frequency signal at a second substrate antenna coupled to a secondsubstrate transceiver (step 288). Finally, the method includes producingthe signal received from the substrate antenna to logic or a processorfor further processing (step 292). Generally, the method of FIG. 7relates to the transmission of electromagnetic signals through asubstrate of a printed circuit board, a board that houses integratedcircuits or die, or even through an integrated circuit substratematerial. In general, the substrate is formed of a dielectric materialand is operable as a wave guide.

FIG. 8 is a functional block diagram of a substrate 300 illustratingthree levels of transceivers according to one embodiment of the presentinvention. As may be seen, a substrate transceiver 302 is operablydisposed upon a surface of a dielectric substrate to communicate with asubstrate transceiver 304 through dielectric substrate 308. Substratetransceiver 304 is further operable to communicate with substratetransceiver 312 that also is operably disposed upon a surface ofdielectric substrate 308. As may be seen, substrate transceiver 304 isembedded within dielectric substrate 308. To reduce or eliminateinterference between communication signals between substratetransceivers 312 and 304, in relation to communications betweensubstrate transceivers 302 and 304, a dielectric substrate 316 that isisolated by an isolating boundary 322 is used to conduct thecommunications between substrate transceiver 312 and substratetransceiver 304. In one embodiment of the invention, the isolatingboundary is formed of metal.

In an alternate embodiment, the isolating boundary is merely a differenttype of dielectric or other material that generates a boundary tooperably reflect electromagnetic radiation away from the dielectricsubstrate surface containing the electromagnetic signal. As such, theisolating boundaries within the dielectric, here within dielectricsubstrate 308, are used to define the volume of dielectric substrateillustrated as dielectric substrate 316 to create a wave guide betweensubstrate transceiver 304 and substrate transceiver 312. In yet anotheralternate embodiment, rather than creating isolated wave guides withinthe primary dielectric substrate, here dielectric substrate 308,directional antennas may be used to reduce or eliminate interferencebetween signals going to different substrate transceivers. For example,if each substrate transceiver shown utilized directional antennas, then,with proper placement and alignment of substrate antennas, interferencemay be substantially reduced thereby avoiding the need for the creationof isolating boundaries that define a plurality of wave guides within adielectric substrate.

Continuing to examine FIG. 8, it may be seen that a remote communicationtransceiver 324 is operably disposed to communicate with substratetransceiver 302, while an intra-system local transceiver 328 is operablydisposed to communicate with substrate transceiver 312. In the describedembodiment of the invention, the intra-system or intra-devicetransceiver 328 is a local transceiver for short range local wirelesscommunications through space with other local intra-device transceivers328. References to “local” are made to indication a device that isoperable to generate wireless transmissions that are not intended fortransceivers external to the device that houses the local transceiver.

In one embodiment, a low efficiency antenna may be used forcommunications between local intra-device transceivers and betweensubstrate transceivers. Because the required transmission distance isvery minimal since the transmissions are to local transceivers locatedon the same board, integrated circuit or device, local low efficientantenna structures may be utilized. Moreover by using a very high radiofrequency that is at least 10 GHz, and, in one embodiment, by utilizinga frequency band of approximately 55 GHz to 65 GHz, such low efficiencyantenna structures have electromagnetic properties that supportoperation within the desired high frequency band.

Remote communication transceiver 324, on the other hand, is forcommunicating with remote transceivers external to the device thathouses substrate 300. Thus, for example, if intra-device transceiver 328were to receive a short range wireless communication from another localintra-device transceiver, intra-device transceiver 328 could operablyconduct the received signals to substrate transceiver 312 which wouldthen be operable to conduct the signals through dielectric substrate 316to substrate transceiver 304 which, in turn, could radiate the signalsto substrate transceiver 302 for delivery to remote communicationtransceiver 324. Network/Device transceiver 324 could then transmit thecommunication signals in the form of electromagnetic radiation to aremote wireless transceiver.

It should be understood that the described operation herein is but oneexemplary embodiment that corresponds to the block diagram of FIG. 8.Alternatively, such communication signals may be relayed through more orless substrate transceivers to conduct the communication signals fromone location to another. For example, in one alternate embodiment, onlysubstrate transceivers 312 and 302 would be used for such communicationsto deliver signals from intra-device transceiver 328 to remotecommunication transceiver 324 or vice versa.

More generally, as may be seen, the block diagram of FIG. 8 illustratesthree levels of transceivers. First, substrate transceivers are used forradiating electromagnetic signals at a very high frequency through adielectric substrate which may be formed in a board that housesintegrated circuits or die, in a printed circuit board, or even within asubstrate of an integrated circuit. A second level of transceiver is theintra-device local transceiver, such as intra-device transceiver 328,for generating very short range wireless communication signals throughspace to other local intra-device transceivers. As described before,such local transceivers are for local communications all containedwithin a specified device. Finally, the third level of transceiver isthe remote communication transceiver 324 which is a remote transceiverfor wireless communications with remote devices external to the devicehousing substrate 300 in each of these transceivers.

FIG. 9 is a functional block diagram of a multi-chip module formedaccording to one embodiment of the present invention. As may be seen, amulti-chip module 330 includes a plurality of die that each includes aplurality of substrate transceivers, and at least one intra-device localtransceiver. Moreover, at least one of the die includes a remotecommunication transceiver for communications with remote devices. Whilea multi-chip module is not required to include a remote communicationtransceiver for communications with other remote devices, the embodimentshown in FIG. 9 does include such a remote communication transceiver.

As may be seen, each die is separated from an adjacent die by a spacer.As such, in the illustrated embodiment, a plurality of four die areincluded, which four die are operably separated by three spacers. Eachof the four die includes two substrate transceivers that are operable tocommunicate through a dielectric substrate operable as a wave guide.Additionally, at least one substrate transceiver is communicativelycoupled to an intra-device transceiver for radiating wirelesscommunication signals through space to another intra-device localtransceiver within the multi-chip module of FIG. 9.

In one embodiment of the invention, at least one intra-device localtransceiver is operable to generate transmission signals at a powerlevel sufficient to reach another intra-device transceiver within adevice, but not outside of the multi-chip module. The antennas for thesubstrate transceivers are not shown for simplicity but they may beformed as described elsewhere here in this specification.

As may further be seen, each of the intra-device local transceiversincludes a shown antenna for the local wireless transmissions throughspace. In the described embodiment of the invention, the wirelesscommunications within the multi-chip module of FIG. 9 are at least 10GHz in frequency and, in one embodiment, are approximately equal to 60GHz. The remote transceiver, as shown, may operate at approximately thesame frequency or a different frequency according to design preferencesand according to the intended remote devices with which the multi-chipmodule of FIG. 9 is to communicate.

Continuing to refer to FIG. 9, it should be understood that each of theembodiments shown previously for substrates and substrate transceiversmay be utilized here in the multi-chip module of FIG. 9. Accordingly, agiven substrate may have more than two substrate transceivers whichsubstrate transceivers may be operably disposed on top of the substrateor within the substrate. Similarly, the antennas for such substratetransceivers, namely the substrate antennas, may be operably disposedupon a surfaces substrate or to at least partially, if not fully,penetrate the substrate for the radiation of electromagnetic signalstherein. Moreover, a plurality of wave guides may be formed within thesubstrate to direct the electromagnetic signals therein from one desiredsubstrate transceiver antenna to another desired substrate transceiverantenna.

In operation, for exemplary purposes, one substrate transceiver of a diemay use the substrate to generate communication signals to anothersubstrate transceiver for delivery to an intra-device local transceiverfor subsequent radiation through space to yet another substrate and,more specifically, to an intra-device local transceiver operablydisposed upon another substrate. As will be described in greater detailbelow, a specific addressing scheme may be used to direct communicationsto a specific intra-device local transceiver for further processing. Forexample, if a communication signal is intended to be transmitted to aremote device, such communication signal processing will occur to resultin a remote transceiver receiving the communication signals by way ofone or more substrates, substrate transceivers, and intra-device localtransceivers.

Continuing to refer to FIG. 9, it should be noted that in addition totransmitting signals through a substrate at a lower power level, thepower level for wireless transmissions between intra-device localtransceivers may also be at a lower power level. Moreover, higher levelsof modulation may be used based on the type of transmission. Forexample, for transmissions through a wave guide in a substrate, thehighest orders of modulation may be used. For example, a signal may bemodulated as a 128 QAM signal or as a 256 QAM signal. Alternatively, forintra-device local transceiver transmissions, the modulation may stillbe high, e.g., 64 QAM or 128 QAM, but not necessarily the highest levelsof modulation. Finally, for transmissions from a remote transceiver to aremote device, more traditional modulation levels, such as QPSK or 8 PSKmay be utilized according to expected interference conditions for thedevice.

In one embodiment of the invention, at least one die is a flash memorychip that is collocated within the same device that a processor. Theintra-device transceivers are operable to establish a high data ratecommunication channel to function as a memory bus. As such, no traces orlines are required to be routed from the flash memory die to theprocessor die. Thus, the leads shown in FIG. 9 represent power lines toprovide operating power for each of the die. At least some of the die,therefore, use wireless data links to reduce pin out and trace routingrequirements. Continuing to refer to FIG. 9, other application specificdevices may be included. For example, one die may include logic that isdedicated for other functions or purposes.

One aspect of the embodiment of FIGS. 8 and 9 is that a remote devicemay, by communicating through the remote communication transceiver andthen through the intra-device and/or substrate transceivers within adevice or integrated circuit, access any specified circuit module withinthe device to communicate with the device. Thus, in one embodiment, aremote tester is operable to communicate through the remotecommunication transceiver of the device housing the substrate of FIG. 8or the multi-chip module of FIG. 9 and then through communicativelycoupled intra-device transceivers to test any or all of the circuitmodules within. Alternatively, a remote device may use the remotecommunication transceiver and intra-device and/or substrate localtransceivers to access any resource within a device. For example, aremote device may access a memory device, a processor or a specializedapplication (e.g. a sensor) through such a series of communicationlinks. A further explanation of these concepts may also be seen inreference to FIGS. 25 and 26.

FIG. 10 is a flow chart of a method for communicating according to oneembodiment of the present invention. The method includes generating afirst radio frequency signal for reception by a local transceiveroperably disposed within a same die (step 340). A second step includesgenerating a second RF signal for reception by a local transceiveroperably disposed within a same device (step 344). Finally, the methodincludes generating a third RF signal for reception by a remotetransceiver external to the same device based upon one of the first andsecond RF signals (step 348).

In one embodiment of the present invention, the first, second and thirdRF signals are generated at different frequency ranges. For example, thefirst radio frequency signals may be generated at 60 GHz, while thesecond RF signals are generated at 30 GHz, while the third RF signalsare generated at 2.4 GHz. Alternatively, in one embodiment of theinvention, the first, second and third RF signals are all generated at avery high and substantially similar frequency. For example, each mightbe generated as a 60 GHz (+/−5 GHz) signal. It is understood that thesefrequencies refer to the carrier frequency and may be adjusted slightlyto define specific channels of communication using frequency divisionmultiple access-type techniques. More generally, however, at least thefirst and second RF signals are generated at a frequency that is atleast as high as 10 GHz.

FIG. 11 is a diagram that illustrates transceiver placement within asubstrate according to one embodiment of the present invention. As maybe seen, a substrate 350 includes a plurality of transceivers 354, 358,362, 366 and 370, that are operably disposed in specified locations inrelation to each other to support intended communications there between.More specifically, the transceivers 354-370 are placed within peak areasand null areas according to whether communication links are desiredbetween the respective transceivers. The white areas within theconcentric areas illustrate subtractive signal components operable toform a signal null, while the shaded areas illustrate additive signalcomponents operable to form a signal peak.

More specifically, it may be seen that transceiver 354 is within a peakarea of its own transmissions, which peak area is shown generally at374. Additionally, a peak area may be seen at 378. Null areas are shownat 382 and 386. Peak areas 374 and 378 and null areas 382 and 386 are inrelation to transceiver 354. Each transceiver, of course, has its ownrelative peak and null areas that form about its transmission antenna.One aspect of the illustration of FIG. 11 is that transceivers areplaced within peak and null areas in relation to each other according towhether communication links are desired between the respectivetransceivers.

One aspect of the embodiment of FIG. 11 is that a device may changefrequencies to obtain a corresponding null and peak pattern tocommunicate with specified transceivers. Thus, if transceiver 354 wishesto communicate with transceiver 366 (which is in a null region for thefrequency that generates the null and peak patterns shown in FIG. 11),transceiver 354 is operable to change to a new frequency that produces apeak pattern at the location of transceiver 366. As such, if a dynamicfrequency assignment scheme is used, frequencies may desirably bechanged to support desired communications.

FIG. 12 is an illustration of an alternate embodiment of a substrate 350that includes the same circuit elements as in FIG. 11 but also includesa plurality of embedded wave guides between each of the transceivers toconduct specific communications there between. As may be seen,transceiver 354 is operable to communicate with transceiver 358 over adedicated wave guide 402. Similarly, transceiver 354 is operable tocommunicate with transceiver 362 over a dedicated waveguide 406. Thus,with respect to transceiver 362, peak area 394 and null area 398 areshown within isolated substrate 390.

Wave guide 390 couples communications between transceivers 362 and 370.While the corresponding multi-path peaks and nulls of FIG. 11 areduplicated here in FIG. 12 for transceiver 354, it should be understoodthat the electromagnetic signals are being conducted between thetransceivers through the corresponding wave guides in one embodiment ofthe invention. Also, it should be observed that the actual peak and nullregions within the contained wave guides are probably different thanthat for the general substrate 350 but, absent more specificinformation, are shown to correspond herein. One of average skill in theart may determine what the corresponding peak and null regions of theisolated wave guides 402, 406 and 390 will be for purposes ofcommunications that take advantage of such wave guide operationalcharacteristics.

FIG. 13 is a flow chart that illustrates a method according to oneembodiment of the present invention. The method includes initiallygenerating radio frequency signals for a first specified localtransceiver disposed within an expected electromagnetic peak of thegenerated radio frequency signals (step 400). The expectedelectromagnetic peak is a multi-path peak where multi-path signals areadditive. The signals that are generated are then transmitted from anantenna that is operationally disposed to communicate through a waveguide formed within a substrate (step 404). The substrate may be that ofa board, such as a printed circuit board, or of a die, such as anintegrated circuit die.

The method also includes generating wireless transmissions to a secondlocal transceiver through either the same or a different and isolatedwave guide (step 408). Optionally, the method of FIG. 13 includestransmitting communication signals to a second local transceiver throughat least one trace (step 412). As may be seen, transmissions are notspecifically limited to electromagnetic signal radiations through spaceor a wave guide or, more generally, through a substrate material such asa dielectric substrate.

FIG. 14 is a functional block diagram of an integrated circuitmulti-chip device and associated communications according to oneembodiment of the present invention. As may be seen, a device 450includes a plurality of circuit boards 454, 458, 462 and 466, that eachhouses a plurality of die. The die may be packaged or integratedthereon. The device of FIG. 14 may represent a device having a pluralityof printed circuit boards, or alternatively, a multi-chip module havinga plurality of integrated circuit die separated by spacers. As may beseen, board 454 includes transceivers 470, 474, and 478 that areoperable to communicate with each other by way of local transceivers. Inone embodiment of the invention, the local transceivers are substratetransceivers that generate electromagnetic radiations through waveguides within board 454.

As stated before, board 454 may be a board such as a printed circuitboard that includes a dielectric substrate operable as a wave guide, ormay be an integrated circuit that includes a dielectric wave guide forconducting the electromagnetic radiation. Alternatively, thetransceivers 470, 474, and 478, may communicate by way of intra-devicelocal transceivers that transmit through space but only for shortdistances. In one embodiment of the invention, the local intra-devicetransceivers are 60 GHz transceivers having very short wavelength andvery short range, especially when a low power is used for thetransmission. In the embodiment shown, power would be selected thatwould be adequate for the electromagnetic radiation to cover the desireddistances but not necessarily to expand a significant distance beyond.

As may also be seen, transceiver 470 is operable to communicate with atransceiver 482 that is operably disposed on board 458 and with atransceiver 486 that is operably disposed on board 458. In this case,local intra-device wireless transceivers for transmitting through spaceare required since transceivers 482 and 486 are placed on a different orintegrated circuit die. Similarly, transceiver 478 is operable tocommunicate with transceiver 490 that is operably disposed on board 466.As before, transceiver 478 and transceiver 490 communicate utilizinglocal intra-device wireless transceivers. As may also be seen, a localintra-device transceiver 494 on board 462 is operable to communicatewith a local intra-device transceiver 498 that further includes anassociated remote transceiver 502 for communicating with remote devices.As may be seen, remote transceiver 502 and local transceiver 498 areoperatively coupled. Thus, it is through transceiver 502 that device 450communicates with external remote devices.

In one embodiment of the present invention, each of the boards 454, 458,462, and 466, are substantially leadless boards that primarily providestructural support for bare die and integrated circuits. In thisembodiment, the chip-to-chip communications occur through wave guidesthat are operably disposed between the various integrated circuit orbare die, or through space through local wireless intra-devicetransceivers. Alternatively, if each board 454-466 represents a printedcircuit board, then the wireless communications, whether through asubstrate or through space, augment and supplement any communicationsthat occur through traces and lead lines on the printed circuit board.

One aspect of the embodiment of device 450 shown in FIG. 14 is that ofinterference occurring between each of the wireless transceivers. Whiletransmissions through a wave guide by way of a dielectric substrate mayisolate such transmissions from other wireless transmissions, therestill exist a substantial number of wireless transmissions through spacethat could interfere with other wireless transmissions all within device450. Accordingly, one aspect of the present invention includes a devicethat uses frequency division multiple access for reducing interferencewithin device 450.

FIG. 15 is a functional block diagram that illustrates operation of oneembodiment of the present invention utilizing frequency divisionmultiple access for communication within a device. As may be seen in theembodiment of FIG. 15, a device 500 includes intra-device localtransceiver A is operable to communicate with intra-device localtransceiver B and C utilizing f₁ and f₂ carrier frequencies. Similarly,intra-device local transceivers B and C communicate using f₃ carrierfrequency. Intra-device local transceiver B also communicates withintra-device local transceiver D and E utilizing f₄ and f₅ carrierfrequencies. Intra-device local transceiver D communicates withintra-device local transceiver E using f₆ carrier frequency. Because ofspace diversity (including range differentiation), some of thesefrequencies may be reused as determined by a designer. Accordingly, asmay be seen, f₁ carrier frequency may be used between intra-device localtransceivers C and E, as well as C and G. While f₇ carrier frequency isused for communications between intra-device local transceivers C and F,f₈ carrier frequency may be used for communications between intra-devicelocal transceivers E and F, as well as D and G. Finally, intra-devicelocal transceivers F and G are operable to communicate using f₂ carrierfrequency. As may be seen, therefore, f₁, f₂, and f₈ carrier frequencysignals have been reused in the frequency plan of the embodiment of FIG.15.

Another aspect of the topology of FIG. 15 is that within the various dieor transceivers, according to application, substrate transceivers existthat also use a specified carrier frequency for transmissions throughthe dielectric substrate wave guides. Here in FIG. 15, such carrierfrequency is referred to simply as f_(s). It should be understood thatf_(s) can be any one of f₁ through f₈ in addition to being yet adifferent carrier frequency f₉ (not shown in FIG. 15).

As described before in this specification, the substrate transceiversare operable to conduct wireless transmissions through a substrateforming a wave guide to couple to circuit portions. Thus, referring backto FIG. 15, for transmissions that are delivered to intra-device localtransceiver D for delivery to remote transceiver H, a pair of localsubstrate transceivers are utilized to deliver the communication signalsreceived by intra-device local transceiver D to remote transceiver H forpropagation as electromagnetic signals through space to another remotetransceiver.

Generally, in the frequency plan that is utilized for the embodiment ofFIG. 15, the transceivers are statically arranged in relation to eachother. As such, concepts of roaming and other such known problems do notexist. Therefore, the carrier frequencies, in one embodiment, arepermanently or statically assigned for specific communications betweennamed transceivers. Thus, referring to FIG. 16 now, a table is shownthat provides an example of the assignment static or permanentassignment of carrier frequencies to specified communications betweenintra-device local transceivers, substrate transceivers, and othertransceivers within a specified device. For example, f₁ carrierfrequency is assigned to communications between transceivers A and B.

A carrier frequency is assigned for each communication link between aspecified pair of transceivers. As described in relation to FIG. 15,space diversity will dictate what carrier frequencies may be reused ifdesired in one embodiment of the invention. As may also be seen, theembodiment of FIG. 16 provides for specific and new carrier frequencyassignments for communications between specific substrate transceivers,such as substrate transceiver M and substrate transceiver N andsubstrate transceiver M with substrate transceiver O. This specificexample is beneficial, for example, in an embodiment having three ormore substrate transceivers within a single substrate, whether thatsingle substrate is an integrated circuit or a printed circuit board. Assuch, instead of using isolated wave guides as described in previousembodiments, frequency diversity is used to reduce interference.

Referring back to FIG. 15, it may be seen that a plurality of dashedlines are shown operatively coupling the plurality of intra-device localtransceivers. For example, one common set of dashed lines couplestransceivers A, B and C. On the other hand, dashed lines are used tocouple transceivers C and G, C and F, and G and F. Each of these dashedlines shown in FIG. 15 represents a potential lead or trace that is usedfor carrying low bandwidth data and supporting signaling and power.Thus, the wireless transmissions are used to augment or add tocommunications that may be had by physical traces. This is especiallyrelevant for those embodiments in which the multiple transceivers areoperably disposed on one or more printed circuit boards.

One aspect of such a system design is that the wireless transmissionsmay be utilized for higher bandwidth communications within a device. Forexample, for such short range wireless transmissions where interferenceis less of a problem, higher order modulation techniques and types maybe utilized. Thus, referring back to FIG. 16, exemplary assignments offrequency modulation types may be had for the specified communications.For example, for wireless communication links between transceivers A, B,C, D, E, F and G, either 128 QAM or 64 QAM is specified for thecorresponding communication link as the frequency modulation type.However, for the communication link between intra-device localtransceivers G and D, 8 QAM is specified as the frequency modulationtype to reflect a greater distance and, potentially, more interferencein the signal path. On the other hand, for the wireless communicationlinks between substrate transceivers, the highest order modulationknown, namely 256 QAM, is shown as being assigned since the wirelesstransmissions are through a substrate wave guide that has little to nointerference and is power efficient. It should be understood that theassigned frequency modulation types for the various communication linksare exemplary and may be modified according to actual expected circuitconditions and as is identified by test. One aspect that is noteworthy,however, of this embodiment, is that frequency subcarriers and frequencymodulation types, optionally, may be statically assigned for specifiedwireless communication links.

FIG. 17 is a functional block diagram of a device 550 housing aplurality of transceivers and operating according to one embodiment ofthe present invention. Referring to FIG. 17, a pair of substrates 554and 558 are shown which each include a plurality of substrates disposedthereon, which substrates further include a plurality of transceiversdisposed thereon. More specifically, substrate 554 includes substrates562, 566 and 570, disposed thereon. Substrate 562 includes transceivers574 and 578 disposed thereon, while substrate 566 includes transceivers582 and 586 disposed thereon. Finally, substrate 570 includestransceivers 590 and 594 disposed thereon. Similarly, substrate 558includes substrates 606, 610 and 614.

Substrate 606 includes transceivers 618 and 622, while substrate 610includes transceivers 626 and 630 disposed thereon. Finally, substrate614 includes transceivers 634 and 638 disposed thereon. Operationally,there are many aspects that are noteworthy in the embodiments of FIG.17. First of all, transceivers 574 and 578 are operable to communicatethrough substrate 562 or through space utilizing assigned carrierfrequency f₂. While not specifically shown, transceivers 574 and 578 maycomprise stacked transceivers, as described before, or may merelyinclude a plurality of transceiver circuit components that supportwireless communications through space, as well as through the substrate562. Similarly, substrate 566 includes substrate transceivers 582 and586 that are operable to communicate through substrate 566 using carrierfrequency f₃, while substrate 570 includes transceivers 590 and 594 thatare operable to communicate through substrate 570 using carrierfrequency f_(s).

As may also be seen, transceiver 590 of substrate 570 and transceiver578 of substrate 562 are operable to communicate over a wirelesscommunication link radiated through space (as opposed to through asubstrate). On the other hand, substrate 562 and substrate 566 eachinclude substrate transceivers 598 and 602 that are operable tocommunicate through substrate 554. As such, layered substratecommunications may be seen in addition to wireless localizedcommunications through space. As may also be seen; transceiver 578 ofsubstrate 562 is operable to communicate with transceiver 634 ofsubstrate 614 which is disposed on top of substrate 558. Similarly,transceiver 634 is operable to wirelessly communicate by radiatingelectromagnetic signals through space with transceiver 622 which isoperably disposed on substrate 606. Transceivers 622 and 618 areoperable to communicate through substrate 606, while transceivers 626and 630 are operable to communicate through substrate 610. Finally,transceiver 634 is operable to communicate through substrate 614 withtransceiver 638.

While not shown herein, it is understood that any one of thesetransceivers may communicate with the other transceivers and may includeor be replaced by a remote transceiver for communicating with otherremote devices through traditional wireless communication links. Withrespect to a frequency plan, as may be seen, a frequency f₁ is assignedfor the communication link between transceivers 578 and 634, whilecarrier frequency f₂ is assigned for transmissions between transceivers574 and 578. Carrier frequency f₃ is assigned for transmissions betweentransceivers 578 and 590, as well as 622 and 634. Here, space diversity,as well as assigned power levels, is used to keep the two assignments ofcarrier frequency f₃ from interfering with each other and creatingcollisions.

As another aspect of the present embodiment of the invention, thecarrier frequencies may also be assigned dynamically. Such a dynamicassignment may be done by evaluating and detecting existing carrierfrequencies and then assigning new and unused carrier frequencies. Suchan approach may include, for example, frequency detection reportingamongst the various transceivers to enable the logic for any associatedtransceiver to determine what frequency to dynamically assign for apending communication. The considerations associated with making suchdynamic frequency assignments includes the power level of thetransmission, whether the transmission is with a local intra-devicetransceiver or with a remote transceiver, and whether the detectedsignal is from another local intra-device transceiver or from a remotetransceiver.

FIG. 18 is a flow chart that illustrates a method for wirelesstransmissions in an integrated circuit utilizing frequency divisionmultiple access according to one embodiment of the invention. The methodincludes, in a first local transceiver, generating and transmittingcommunication signals to a second local transceiver utilizing a firstspecified carrier frequency (step 650). The method further includes, inthe first local transceiver, transmitting to a third local transceiverutilizing a second specified carrier frequency wherein the second localtransceiver is operably disposed either within the integrated circuit orwithin a device housing the integrated circuit (step 654).

References to local transceivers are specifically to transceivers thatare operably disposed within the same integrated circuit, printedcircuit board or device. As such, the communication signals utilizingthe frequency diversity are signals that are specifically intended forlocal transceivers and are, in most embodiments, low power highfrequency radio frequency signals. Typical frequencies for these localcommunications are at least 10 GHz. In one specific embodiment, thesignals are characterized by a 60 GHz carrier frequency.

These high frequency wireless transmissions may comprise electromagneticradiations through space or through a substrate, and more particularly,through a wave guide formed by a dielectric substrate formed within adie of an integrated circuit or within a board (including but notlimited to printed circuit boards). Thus, the method further includestransmitting from a fourth local transceiver operably coupled to thefirst local transceiver through a wave guide formed within the substrateto a fifth local transceiver operably disposed to communicate throughthe substrate (step 658).

In one embodiment of the invention, the fourth local transceiverutilizes a permanently assigned carrier frequency for the transmissionsthrough the wave guide. In a different embodiment of the invention, thefourth local transceiver utilizes a determined carrier frequency for thetransmissions through the wave guide, wherein the determined carrierfrequency is chosen to match a carrier frequency being transmitted bythe first local transceiver. This approach advantageously reduces afrequency conversion step.

With respect to the carrier frequencies for the electromagneticradiations to other local transceivers through space, the first andsecond carrier frequencies are statically and permanently assigned inone embodiment. In an alternate embodiment, the first and second carrierfrequencies are dynamically assigned based upon detected carrierfrequencies. Utilizing dynamically assigned carrier frequencies isadvantageous in that interference may further be reduced or eliminatedby using frequency diversity to reduce the likelihood of collisions orinterference. A disadvantage, however, is that more overhead is requiredin that this embodiment includes logic for the transmission ofidentified carrier frequencies or channels amongst the localtransceivers to coordinate frequency selection.

FIG. 19 is a functional block diagram that illustrates an apparatus andcorresponding method of wireless communications within the apparatus foroperably avoiding collisions and interference utilizing a collisionavoidance scheme to coordinate communications according to oneembodiment of the invention. More specifically, a plurality of localtransceivers for local communications and at least one remotetransceiver for remote communications operably installed on anintegrated circuit or device board having a plurality of integratedcircuit local transceivers are shown.

The collision avoidance scheme is utilized for communications comprisingvery high radio frequency signals equal to or greater than 10 GHz infrequency for local transceiver communications amongst localtransceivers operably disposed within the same device and even withinthe same supporting substrate. Referring to FIG. 19, a plurality oflocal transceivers are shown that are operable to generate wirelesscommunication signals to other local transceivers located on the sameboard or integrated circuit or with local transceivers on a proximateboard (not shown here in FIG. 19) within the same device.

In addition to the example of FIG. 19, one may refer to other Figures ofthe present specification for support therefor. For example, FIGS. 9, 14and 17 illustrate a plurality of boards/integrated circuits(collectively “supporting substrates”) that each contain localtransceivers operable to wirelessly communicate with other localwireless transceivers. In one embodiment, at least one supportingsubstrate (board, printed circuit board or integrated circuit die) isoperable to support transceiver circuitry that includes one or moretransceivers thereon. For the embodiments of the invention, at leastthree local transceivers are operably disposed across one or moresupporting substrates, which supporting substrates may be boards thatmerely hold and provide power to integrated circuits, printed circuitboards that support the integrated circuits as well as additionalcircuitry, or integrated circuits that include radio transceivers.

For exemplary purposes, the embodiment of FIG. 19 includes first andsecond supporting substrates 700 and 704 for supporting circuitryincluding transceiver circuitry. A first radio transceiver integratedcircuit 708 is supported by substrate 700, while a second, third andfourth radio transceiver integrated circuit die 712, 716 and 720,respectively, are operably disposed upon and supported by the secondsupporting substrate 704.

At least one intra-device local transceiver is formed upon each of thefirst, second, third and fourth radio transceiver integrated circuit die708-720 and is operable to support wireless communications with at leastone other of the intra-device local transceivers formed upon the first,second, third and fourth radio transceiver integrated circuit die708-720.

The first and second intra-device local transceivers are operable towirelessly communicate with intra-device local transceivers utilizing aspecified collision avoidance scheme. More specifically, in theembodiment of FIG. 19, the collision avoidance scheme comprises acarrier sense multiple access scheme wherein each of the first andsecond intra-device local transceivers is operable to transmit arequest-to-send signal and does not transmit until it receives aclear-to-send response from the intended receiver. Thus, each localtransceiver, in this embodiment, is operable to transmit arequest-to-send signal to a specific local transceiver that is a targetof a pending communication (the receiver of the communication) prior toinitiating a data transmission or communication.

For example, the embodiment of FIG. 19 shows a first local transceiver724 transmitting a request-to-send signal 728 to a second localtransceiver 732. Additionally, each local transceiver is furtheroperable to respond to a received request-to-send signal by transmittinga clear-to-send signal if there is no indication that a channel is inuse. Thus, in the example of FIG. 19, local transceiver 732 generates aclear-to-send signal 736 to local transceiver 724.

As another aspect of the embodiment of FIG. 19, each local transceiverthat receives the clear-to-send signal 736 is operable to set a timer toinhibit transmissions for a specified period. Thus, even thoughclear-to-send signal 736 was transmitted by local transceiver 732 tolocal transceiver 724, each local transceiver that detects clear-to-sendsignal 736 is operable to inhibit or delay future transmissions for aspecified period.

In the example of FIG. 19, local transceiver 732 is further operable tobroadcast the clear-to-send signal 736 to all local transceivers inrange to reduce the likelihood of collisions. Thus, local transceiver732 transmits (by way of associate substrate transceivers) theclear-to-send signal 736 to a local transceiver 740 that is also formedupon die 712.

As may also be seen, a local transceiver 744 is operable to detectclear-to-send signal 736 and to forward the clear-to-send signal 736 toeach local transceiver on the same die 720 by way of local transceivers.In the example shown, local transceiver 744 sends clear-to-send signal736 to a transceiver 748 by way of substrate transceivers within die720.

In one embodiment, the request-to-send signal is only generated for datapackets that exceed a specified size. As another aspect of theembodiments of the present invention, any local transceiver that detectsa clear-to-send signal response sets a timer and delays anytransmissions on the channel used to transmit the clear-to-send signalfor a specified period. In yet another embodiment of the invention, alocal transceiver merely listens for activity on a specified channel andtransmits if no communications are detected.

The collision avoidance scheme in a different embodiment is amaster/slave scheme similar to that used in personal area networksincluding Bluetooth™ protocol or standard devices. As such, a localtransceiver is operable to control a communication as a master or toparticipate as directed in the role of a slave in the master/slaveprotocol communications. Further, the local transceiver is operable tooperate as a master for one communication while operating as a slave ina different but concurrent communication.

FIG. 20 is a functional block diagram of a substrate supporting aplurality of local transceivers operable according to one embodiment ofthe invention. A supporting board 750 is operable to support a pluralityof integrated circuit radio transceivers. In the described embodiment,the transceivers are intra-device local transceivers that are operableto communicate with each other utilizing a very high radio frequency (atleast 10 GHz). The supporting substrate may be any type of supportingboard including a printed circuit board or even an integrated circuitthat includes (supports) a plurality of local transceivers (intra-devicetransceivers). In the embodiment shown, the primary collision avoidancescheme is a master/slave implementation to control communications toavoid conflict and/or collisions. As may be seen, for the presentoperations, a local transceiver 754 (intra-device transceiver) isoperable to control communications as a master for communications withtransceivers 758, 762, 766 and 770. Transceiver 770, which is a slavefor communications with transceiver 754, is a master for communicationswith transceiver 774.

While the primary collision avoidance scheme shown here in FIG. 20 is amaster/slave scheme, it should be understood that a collision avoidancesystem as described in relation to FIG. 19 that includes thetransmission of request-to-send and clear-to-send signals may also beimplemented. In an embodiment of the invention in which the substrate isa board, such as a printed circuit board, the embodiment may furtherinclude a plurality of transceivers within an integrated circuit that issupported by the board. Thus, for example, if an integrated circuit 776comprises an integrated circuit that includes intra-device transceiver766 and a remote communication transceiver 778 in addition to aplurality of substrate transceivers 782, 786 and 790, a collisionavoidance scheme is also implemented for communications within theintegrated circuit 776, then either the same type of a different type ofcollision avoidance scheme may be implemented.

For example, a master/slave scheme is used for intra-device transceiverswhile a carrier sense scheme is used to avoid collisions withinintegrated circuit 776. Moreover, such schemes may be assigned for othercommunications including board-to-board (a local intra-devicetransceiver on a first board to a local intra-device transceiver on asecond board). Moreover, any known collision avoidance scheme may alsobe used by remote communications transceiver 778 for remotecommunications (communications with remote devices). Use of carriersense and master/slave schemes are particularly advantageous forcommunications that are not separated through frequency diversity (FDMAtransmissions), space diversity (directional antennas), or even codediversity if a code division multiple access (CDMA) scheme is utilizedto avoid collisions between intra-device local transceivers.

FIG. 21 illustrates a method for wireless local transmissions in adevice according to one embodiment of the invention. The methodincludes, in a first local transceiver, transmitting to a second localtransceiver a request-to-send signal (step 800). The method furtherincludes, in the first local transceiver, receiving a clear-to-sendsignal generated by a second local transceiver in response to therequest-to-send signal (step 804). After receiving the clear-to-sendsignal, the method includes determining to transmit a data packet to thesecond local transceiver (step 808) wherein the second local transceiveris operably disposed either within the integrated circuit or within adevice housing the integrated circuit.

In one embodiment of the invention, the step of transmitting therequest-to-send signal occurs only when the data packet to betransmitted exceeds a specified size. Finally, the method includesreceiving a clear-to-send signal from a third local transceiver anddetermining to delay any further transmissions for a specified period(step 812). Generally, the method described in relation to FIG. 21 is acarrier sense scheme. Along these lines, variations to carrier senseschemes may be implemented. For example, in one alternate embodiment, adetection of a request-to-send type of signal may trigger a timer ineach local transceiver that detects the request-to-send type of signalto delay transmissions to avoid a conflict. In yet another embodiment, alocal transceiver merely initiates a communication if no othercommunications are detected on a specified communication channel.

FIG. 22 is a functional block diagram a device that includes a meshnetwork formed within a board or integrated circuit according to oneembodiment of the invention. Referring to FIG. 22, each of the localtransceivers supported by a substrate 820 is operable as a node in aboard level mesh network for routing communication signals from onelocal transceiver to another that is out of range for very short rangetransmissions at a very high radio frequency. More specifically, anetwork formed within a device that includes local transceivers A, B, C,D, E, F, G and H is operable to relay communications as a node basedmesh network for defining multiple paths between any two localtransceivers. In the embodiment shown, each of the local transceiverscomprises a very high radio frequency transceiver for communicationswith local intra-device transceivers all within the same device. In oneembodiment, the very high frequency local transceivers communicate atfrequencies that equal at least 10 GHz. In one specific embodiment, thevery high RF signal is a 60 GHz signal. The described embodiments of theinvention include local transceivers that are operable to radiateelectromagnetic signals at a low power to reduce interference withremote devices external to the device housing the board or integratedcircuit (collectively “substrate”) of FIG. 22.

The plurality of local transceivers of FIG. 22 operably form a meshnetwork of nodes that evaluate transceiver loading as well ascommunication link loading. Thus, each of the local transceivers A-H isoperable to transmit, receive and process loading information to otherlocal transceivers within the same device. Moreover, each is operable tomake a next hop (transmit to a next intermediary node or localtransceiver for forwarding towards the final destination node or localtransceiver) and routing decisions based upon the loading information inrelation to destination information (e.g., a final destination for acommunication).

FIG. 23 is a flow chart illustrating a method according to oneembodiment of the invention for routing and forwarding communicationsamongst local transceivers operating as nodes of a mesh network allwithin a single device. The method includes initially generating, in afirst local transceiver of an integrated circuit, a wirelesscommunication signal for a specified second local transceiver andinserting one of an address or an ID of the second local transceiver inthe wireless communication signal (step 830). As a part of transmittingthe communication to the second transceiver, the method includesdetermining whether to transmit the wireless communication signal to athird local transceiver for forwarding the communication towards thesecond local transceiver either directly or to a fourth localtransceiver for further forwarding (step 834). The next step thusincludes sending the communication to the third local transceiverthrough a wireless communication link (step 838). The third localtransceiver may be operably disposed (located) on a different board, adifferent integrated circuit on the same board, or even on the sameintegrated circuit. If on the same integrated circuit or board, themethod optionally includes transmitting the communication within a waveguide formed within same integrated circuit or board or supportingsubstrate (step 842). The method further includes receiving loadinginformation for loading of at least one communication link or at leastone local transceiver (step 846). Thus, the method includes makingrouting and next hop determinations based upon the received loadinginformation (step 850).

A given local transceiver of FIG. 22 is therefore operable to performany combination or subset of the steps of FIG. 23 in addition to othersteps to support operation as a node within a mesh network. Morespecifically, a first local transceiver is operable to forwardcommunications as nodes in a mesh network wherein each node forms acommunication link with at least one other node to forwardcommunications. Communications received at the first local transceiverfrom a second local transceiver located on the same substrate may beforwarded to a third local transceiver located on the same substrate.The first local transceiver is further operable to establish acommunication link with at least one local transceiver operably disposedon a separate substrate whether the separate substrate is a differentintegrated circuit operably disposed on the same board or a differentintegrated circuit operably disposed on a different board.

Each local transceiver, for example, the first and second localtransceivers, is operable to select a downstream local transceiver forreceiving a communication based upon loading. Loading is evaluated forat least one of an integrated circuit or a communication link. Eachoriginating local transceiver is further operable to specify a finaldestination address for a communication and to make transmissiondecisions based upon the final destination address in addition tospecifying a destination address for a next destination of acommunication (the next hop) and to make transmission decisions basedupon a final destination address. Finally, it should be noted that themesh communication paths may be determined statically or dynamically.Thus, evaluating loading condition is one embodiment in which therouting is determined dynamically. In an alternate embodiment, however,communication routing may also be determined statically on a permanentbasis.

FIG. 24 illustrates a method for communications within a deviceaccording to one embodiment of the invention in which communications aretransmitted through a mesh network within a single device. The methodincludes evaluating loading information of at least one of a localtransceiver or of a communication link between two local transceivers(step 860) and determining a next hop destination node comprising alocal transceiver within the device (step 864). Thereafter, the methodincludes transmitting a communication to the next hop destination node,which communication includes a final destination address of a localtransceiver (step 868). Generally, determining the next hop destinationnode is based upon loading information and upon the final destination ofthe communication. For a given route for a communication, communicationlinks may result between local transceivers operably disposed on thesame substrate, between local transceivers on the different integratedcircuits operably disposed on the same substrate, between localtransceivers on the different integrated circuits operably disposed onthe same board, and between local transceivers on the differentintegrated circuits operably disposed on different substrates. A methodoptionally includes utilizing at least one communication link betweenlocal transceivers operably coupled by way of a wave guide formed withina substrate supporting the local transceivers (step 872).

FIG. 25 is a functional block diagram of a network operating accordingto one embodiment of the present invention. A network 900 includes aplurality of devices 904, 908 and 912 that are operable to communicateusing remote communication transceivers 916. These communications may beusing any known communication protocol or standard including 802.11,Bluetooth, CDMA, GSM, TDMA, etc. The frequency for such communicationsmay also be any known radio frequency for the specified communicationprotocol being used and specifically includes 900 MHz, 1800 MHz, 2.4GHz, 60 GHz, etc.

Within each of the devices 904-912, intra-device local transceivers 920communicate with each other at very high radio frequencies that are atleast 10 GHz to provide access to a specific circuit module within thedevice. For example, intra-device local transceivers 920 may be utilizedto provide access to memory 924 or processor 928 of device 904, toprocessors 932 and 936 of device 908, or to processor 940 and sensor 944of device 912. Additionally, where available, access may also be providethrough substrate communications using substrate transceivers 948. Inthe described embodiments, the substrate processors operate at very highradio frequencies of at least 10 GHz.

Within each device, the frequencies used may be statically ordynamically assigned as described herein this specification. Further,mesh networking concepts described herein this specification may be usedto conduct communications through out a device to provide access to aspecified circuit module. Additionally, the described collisionavoidance techniques may be utilized including use of a clear-to-sendapproach or a master/slave approach to reduce interference andcollisions.

As one application of all of the described embodiments, a tester mayaccess any given circuit block or element using any combination of theremote communication transceivers 916, the intra-device localtransceivers 920 or the substrate transceivers 948. As anotherapplication, such inter-device and intra-device communications may beused for resource sharing. Thus, for example, a large memory device maybe placed in one location while a specialty application device and acomputing device are placed in other locations. Such wirelesscommunications thus support remote access to computing power of thecomputing device, to memory of the memory device or to the specificsensor of the specialty application device. While FIG. 25 illustratesdistinct devices 904-912, it should be understood that some of thesedevices may also represent printed circuit boards or supporting boardshousing a plurality of integrated circuit blocks that provide specifiedfunctions. For example a remote device 904 may communicate through theremote communication transceivers with two printed circuit boards 908and 912 within a common device.

FIG. 26 is a flow chart illustrating the use of a plurality of wirelesstransceivers to provide access to a specified circuit block according toone embodiment of the invention. The method includes establishing afirst communication link between remote communication transceivers (step950), establishing a second communication link between eitherintra-device communication transceivers or substrate transceivers toestablish a link to a specified circuit block (step 954), andcommunicating with the specified circuit block to gain access to afunction provided by the specified circuit block (step 958). These stepsinclude coupling the first and second communication links and, asnecessary, translating communication protocols from a first to a secondprotocol and translating frequencies from a first frequency to a secondfrequency. As such, a remote device may access a specified circuit blockto achieve the benefit of a function of the specified circuit block orto obtain data or to test one or more circuit blocks.

As one of ordinary skill in the art will appreciate, the term“substantially” or “approximately”, as may be used herein, provides anindustry-accepted tolerance to its corresponding term and/or relativitybetween items. Such an industry-accepted tolerance ranges from less thanone percent to twenty percent and corresponds to, but is not limited to,component values, integrated circuit process variations, temperaturevariations, rise and fall times, and/or thermal noise. Such relativitybetween items ranges from a difference of a few percent to magnitudedifferences. As one of ordinary skill in the art will furtherappreciate, the term “operably coupled”, as may be used herein, includesdirect coupling and indirect coupling via another component, element,circuit, or module where, for indirect coupling, the interveningcomponent, element, circuit, or module does not modify the informationof a signal but may adjust its current level, voltage level, and/orpower level. As one of ordinary skill in the art will also appreciate,inferred coupling (i.e., where one element is coupled to another elementby inference) includes direct and indirect coupling between two elementsin the same manner as “operably coupled”.

While the invention is susceptible to various modifications andalternative forms, specific embodiments thereof have been shown by wayof example in the drawings and detailed description. It should beunderstood, however, that the drawings and detailed description theretoare not intended to limit the invention to the particular formdisclosed, but, on the contrary, the invention is to cover allmodifications, equivalents and alternatives falling within the spiritand scope of the present invention as defined by the claims. Moreover,the various embodiments illustrated in the Figures may be partiallycombined to create embodiments not specifically described but consideredto be part of the invention. For example, specific aspects of any oneembodiment may be combined with another aspect of another embodiment oreven with another embodiment in its entirety to create a new embodimentthat is a part of the inventive concepts disclosed herein thisspecification. As may be seen, the described embodiments may be modifiedin many different ways without departing from the scope or teachings ofthe invention.

1. A method for communications within a single device, comprising:generating, in a first local transceiver of an integrated circuit, awireless communication signal for a specified second local transceiverand inserting one of an address or an ID of the second local transceiverin the wireless communication signal; and determining whether totransmit the wireless communication signal to a third local transceiverfor forwarding to the second local transceiver.
 2. The method of claim 1wherein the wireless communication signal is sent to the third localtransceiver through a wireless communication link.
 3. The method ofclaim 1 wherein the wireless communication signal is sent to the thirdlocal transceiver through a wireless communication link through anelectromagnetic wave guide operably disposed within the integratedcircuit.
 4. The method of claim 1 wherein the step of determining totransmit the wireless communication to the third local transceiver isbased upon instantaneous loading conditions of the first wirelesstransceiver.
 5. The method of claim 1 further including receivingloading information that reflects loading of communication links withinthe single device.
 6. The method of claim 1 further includingtransmitting over a first communication link between local transceiverson a first substrate and also transmitting over a second communicationlink between local transceivers operably disposed on differentsubstrates.
 7. The method of claim 1 wherein a communication is relayedthrough at least one local transceiver wherein the communication is byway of communication links solely between local transceivers on the sameintegrated circuit.
 8. The method of claim 1 wherein a communication isrelayed through at least one local transceiver wherein the communicationis by way of communication links solely between local transceivers onthe same board.
 9. The method of claim 1 wherein a communication isrelayed through at least one local transceiver wherein the communicationis by way of communication links between local transceivers in the samedevice but wherein at least one communication link is between localtransceivers operably disposed on separate boards within the samedevice.
 10. The method of claim 1 wherein a communication is relayedthrough at least one local transceiver wherein at least onecommunication link is within a wave guide of a substrate.
 11. Anapparatus, comprising: a plurality of local transceivers operable toforward communications as nodes in a mesh network wherein each nodeforms a communication link with at least one other node to forwardcommunications; and wherein a first local transceiver of the pluralityof local transceivers is operable to forward communications receivedfrom a second local transceiver located on the same substrate to a thirdlocal transceiver located on the same substrate.
 12. The apparatus ofclaim 11 wherein the first local transceiver is operable to establish acommunication link with at least one local transceiver operably disposedon a separate substrate.
 13. The apparatus of claim 12 wherein theseparate substrate is a different integrated circuit operably disposedon the same board.
 14. The apparatus of claim 12 wherein the separatesubstrate is a different integrated circuit operably disposed on adifferent board.
 15. The apparatus of claim 12 wherein at least one ofthe first and second local transceivers is operable to select adownstream local transceiver for receiving a communication based uponloading.
 16. The apparatus of claim 15 wherein the loading of at leastone integrated circuit is evaluated.
 17. The apparatus of claim 15wherein the loading of at least one communication link is evaluated. 18.The apparatus of claim 12 wherein each local transceiver is operable tospecify a final destination address for a communication and to maketransmission decisions based upon the final destination address.
 19. Theapparatus of claim 12 wherein each local transceiver is operable tospecify a destination address for a next destination of a communicationand to make transmission decisions based upon a final destinationaddress.
 20. The apparatus of claim 12 wherein communication pathsbetween specified local intra-device transceivers is staticallyspecified.
 21. The apparatus of claim 12 wherein communication pathsbetween specified local intra-device transceivers is dynamicallydetermined based upon loading conditions.
 22. The apparatus of claim 12wherein a local transceiver is operable to determine to establish acommunication link through a wave guide formed within a substratematerial.
 23. The apparatus of claim 11 wherein the first localtransceiver is operable to transmit and receive loading information. 24.A method for communications within a device, comprising: evaluatingloading information of at least one of a local transceiver or of acommunication link between two local transceivers; determining a nexthop destination node comprising a local transceiver within the device,transmitting a communication to the next hop destination node, whichcommunication includes a final destination address of a localtransceiver.
 25. The method of claim 24 wherein determining the next hopdestination node is based upon loading information and upon the finaldestination of the communication.
 26. The method of claim 25 wherein atleast one communication link is between local transceivers operablydisposed on the same substrate.
 27. The method of claim 25 wherein atleast one communication link is between local transceivers on thedifferent integrated circuits operably disposed on the same substrate.28. The method of claim 25 wherein at least one communication link isbetween local transceivers on the different integrated circuits operablydisposed on the same board.
 29. The method of claim 25 wherein at leastone communication link is between local transceivers on the differentintegrated circuits operably disposed on different substrates.
 30. Themethod of claim 25 wherein at least one communication link is betweenlocal transceivers by way of a wave guide formed within a substratesupporting the local transceivers.